Simplifies Design of Mobile Phones With Display Resolution Up to VGA,
  Combines Frame-Buffer Memory and Image-Processing Functions with Support
                for Multiple Baseband and Display Interfaces

    SAN JOSE, Calif., Feb. 12 /PRNewswire/ -- Toshiba America Electronic
Components, Inc. (TAEC)*, a leading supplier of functional analog
peripheral ICs for mobile applications, today announced a milestone in its
recently announced, customer-driven Mobile Strategic Initiative with the
launch of an enhanced Mobile Industry Processor Interface (MIPI(TM))
display buffer/controller. Designated TC358730XBG, the device is the
industry's first controller to support the high-speed MIPI Display Serial
Interface (DSI) specification. With support for a variety of host and
display interfaces, the compact, highly integrated IC simplifies design of
mobile phones with up to Video Graphics Array (VGA) display resolution.
Benefits include reduced component count and lower system power
consumption.
    "Following on the heels of the TAEC Mobile Strategic Initiative
announced last month, the Toshiba industry-leading development of the
enhanced MIPI display buffer/controller is a significant milestone that
demonstrates the company's commitment to customers building the next
generation of cellular handsets," said Andrew Burt, vice president of the
Imaging and Communications Marketing Group for the ASSP Business Unit at
TAEC. "Based on discussions with our mobile-handset customers and leading
baseband/application-processor manufacturers, Toshiba is developing a
family of display-buffer solutions that add flexible interface standards to
the host and display." Mr. Burt explained that the new MIPI device was
based on the core architecture of the existing Toshiba MDDI bridge-client
device (TC358720XBG). It reuses the core architecture, replaces the
MDDI-host interface with a MIPI-compliant interface and adds a high-speed,
serial-output interface.
    The TC358730XBG features 8 Mbit of embedded DRAM (eDRAM) to provide
flexible image buffering for displays with up to VGA resolution. It
provides single-buffer operation for images with up to VGA resolution, and
automatic double buffering when handling two images with resolutions up to
HVGA. Designed for use across a variety of mobile phone platforms, the
TC358730XBG supports the existing MIPI DBI type-B specification for command
and video data and the MIPI DPI specification for video data plus the MIPI
DBI type-C baseband-interface standards for command data. The controller
also supports the upcoming high-speed serial MIPI DSI baseband interface
for command and video data. It provides LCD-module interface support for
parallel MIPI DPI interfaces as well as for a common high-speed serial
interface.
    TC358730XBG helps reduce system-power consumption by accepting
high-speed, burst-access data transfer from the host, which can then enter
low-power sleep mode while the controller updates the connected LCD at the
required frame rate. A low-power eDRAM implementation, low-leakage process
technology and 'Sleep' and 'Deep Sleep' modes also contribute to reduce
power consumption.
    On-board image-processing functions include pixel doubling to scale
lower resolution images up to higher resolution displays, rotation of
incoming images, and the mirroring of both incoming and outgoing images. In
addition, Toshiba integrated its patented Magic Square(TM) algorithm into
the new controller to provide sophisticated image-quality enhancement
capabilities. With the algorithm, an RGB666 18-bit LCD panel can produce
picture quality equivalent to an RGB888 24-bit LCD panel with up to
16-million colors.
    Integration of a pulse-width modulation output for flexible backlight
control and a MIPI DBI type-C master for display control offers additional
space and component-count savings. A MIPI DCS-compliant software interface
allows rapid software integration by the handset manufacturer.
    Product features in summary:
    *  Supports up to 3 host-interface standards
    *  Supports the primary LCD display plus a secondary LCD display through
       DBI type C
    *  Features a MIPI DBI Type B host interface with parallel RGB plus DBI
       Type C and DSI
    *  Integrates 8 Mbit eDRAM for frame-buffer memory
    *  Provides voltage of 1.8 volts (V) for the I/O, 2.3V to 2.9V for the
       eDRAM, 1.2V for internal-core operation and 1.8V for external-core
       operation
    *  Packaging is a compact 64-pin BGA with dimensions of 5mm x 5mm x 1mm

    Pricing and Availability
    TC358730XBG is being sampled to select customers now. Sample pricing is
projected to be in the range of $20.00 to $25.00 each in 10,000-piece
quantities. Volume production is planned to start in the second half of
2007.
    About the MIPI Alliance and the DSI and DCS Specifications
    The Mobile Industry Processor Interface (MIPI) Alliance is a
collaboration of mobile industry leaders with the objective to define and
promote open standards for interfaces to mobile application processors. The
MIPI Display Serial Interface (DSI) and Display Command Set (DCS)
specifications, announced in May 2006, are the latest in a series of MIPI
standards published or planned by the MIPI Alliance. DSI is based upon the
MIPI D-PHY physical-layer specification, a robust, high-speed, low-power,
scalable serial interconnect. DCS is an application-layer specification for
smart display panels.
    About the TAEC Mobile Strategic Initiative
    Unveiled in January, 2007, the TAEC Mobile Strategic Initiative is a
comprehensive program to help the company's U.S.-based mobile
handset/mobile terminal customers achieve faster time-to-market and stay
competitive. Over a twelve- to fifteen-month timeframe, TAEC plans to roll
out an expanded product portfolio, including newly developed products as
well as products never offered before to the U.S. market. These
discrete-analog and mixed-signal building blocks provide the connectivity
between the baseband and various functions, including the display, camera,
keypads and external storage devices. The TAEC customer-driven solutions
offer flexibility and modularity across multiple platforms, including the
ability to tailor solutions to customer needs as a customer-specific
standard product (CSSP). Along with these products, TAEC provides local
application and design-in support. In addition, TAEC will offer all
necessary support tools for customer evaluation, including evaluation
boards, development boards and reference designs.
    *About TAEC
    Combining quality and flexibility with design engineering expertise,
TAEC brings a breadth of advanced, next-generation technologies to its
customers. This broad offering includes memory and flash memory-based
storage solutions, a broad range of discrete devices, displays, medical
tubes, ASICs, custom SOCs, microprocessors, microcontrollers and wireless
components for the computing, wireless, networking, automotive and digital
consumer markets.
    TAEC is an independent operating company owned by Toshiba America,
Inc., a subsidiary of Toshiba Corp. (Toshiba), Japan's largest
semiconductor manufacturer and the world's fourth largest semiconductor
manufacturer. In more than 130 years of operation, Toshiba has recorded
numerous firsts and made many valuable contributions to technology and
society. For additional company and product information, please visit
TAEC's website at chips.toshiba.com. For technical inquiries, please e-mail
Tech.Questions@taec.toshiba.com.
    Information in this press release, including product pricing and
specifications, content of services and contact information, is current and
believed to be accurate on the date of the announcement, but is subject to
change without prior notice. Technical and application information
contained here is subject to the most recent applicable Toshiba product
specifications. In developing designs, please ensure that Toshiba products
are used within specified operating ranges as set forth in the most recent
Toshiba product specifications and the information set forth in Toshiba's
"Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor
Reliability Handbook." This information is available at
http://www.chips.toshiba.com, or from your TAEC representative.
    All trademarks and tradenames used herein are the properties of their
respective holders. MIPI is a trademark of the Mobile Industry Processor
Interface Alliance.