TRANSDIMENSION, INC.

Acquired By Oxford Semiconductor

135 Technology Drive, Suite 250

Irvine, CA 92618 USA

Tel: (949)727-2020

Fax: (949)727-3232

Transdimension, since acquired by Oxford Semiconductor, offers USB cores, chips and software for embedded applications. As of June, 2004, the company had shipped 5 million embedded USB host controllers.

FAST FACTS

Classification: IC, IP Core, Fabless

Founded: 1997,

Funding Report 2003: Series C

Funding Report 2004: $18 Million (July)

MAIN INTEGRATED CIRCUIT TECHNOLOGY

Bus: USB Host, Peripheral and OTG Controllers

IP CORES

Bus: USB OTG/Host/Device IP Core

SOFTWARE

Bus: USBLink Host Software

GENERAL CONTACTS

Sales: sales@transdimension.com

Technical Support: tech_support@transdimension.com

Software Support: software_support@transdimension.com

IP Core Information: ip_info@transdimension.com

Marketing: marketing@transdimension.com

Information: info@transdimension.com

Investor Relations investor_relations@transdimension.com

Marketing Communications: news@transdimension.com

Employment: hr@transdimension.com

URL: www.transdimension.com

MANAGEMENT

Rick Goerner, President and Chief Executive Officer

Jay Standiford, Vice President, ASIC Engineering

Pete Todd, Vice President, Worldwide Sales

END MARKETS

Cellular Phones

Compact Disks (CD)

Digital Cameras

DVD

Flash Drives

MP3 Players

PDAs

Printers

Settop Boxes

ACQUISITIONS

2001: Softconnex, ARC International’s peripheral connectivity property and product portfolio

CUSTOMERS

Customers: ATI, Levovo, QUALCOMM, Pioneer, Sony, Panasonic, Motorola, Pace, Thomson Multimedia, marketing collaboration agreement with ARM Limited (UK

Customers 2004: NEC Electronics Corporation (USB on the Go), STMicroelectronics, USBLink Host Software Solution

Customers 2003: ATI Technologies (USB OTG Core), Motorola (USB OTG Core), NeoMagic (USB On-The-Go), Samsung (USBLink Host Software Solution)

PARTNERS

MEMEC (2004), JSI (2004, Singapore)

ORGANIZATION AFFILIATIONS

WiMedia Alliance