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Message: Re: Sensonor Technologies
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Oct 08, 2009 06:30AM

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Oct 08, 2009 09:47AM

Sensonor Technologies AS

Horten, Norway

Sensonor Technologies is a leading manufacturer of Gyro and Pressure products that provide global customers with innovative solutions to enhance their profits. The company makes a real difference in the industrial sensor community by focusing on products based on MEMS technology, but for High Precision applications. Our solutions show unbeaten performance for demanding applications where the combination of size, performance and robustness matter.

Enabling solutions
Sensonor Technologies makes a difference in the industrial sensor and transducer community by focusing on products based on MEMS technology, but for High Precision applications.
Our devotion is to serve customers with enabling solutions when the combination of size, performance and robustness matter. We offer products that can replace existing non efficient technology.

Outstanding reliability
Sensonor has for 25 years played a significant role in the global MEMS industry. Over the years, more than 200 million pressure sensors, more than 200 million accelerometers, and more than 2 million gyros have been shipped to customers for use in numerous type of applications. Less than 0.1ppm field failures are the ultimate proof of long term dedication and capability.

In general Sensonor's products are micro systems built by the combination of a heterogeneous MEMS sensing-actuating die and a mixed-mode (both analogue and digital) ASIC (application specific integrated circuit) assembled and connected into the same sensor housing. The design of the ASIC function is an integrated part of the product development task and the final manufacturing of the actual ASIC die is conducted by world recognized foundries. The heterogeneous MEMS die is manufactured in-house at Sensonor.

All Sensonor development programs rely heavily on an extensive concept and feasibility phase using model and simulation tools to fully understand the complete system including the heterogeneous MEMS structure and the integrated CMOS circuitry (ASIC). Such simulations typically include mechanical, thermal, optical, electrostatic and other properties to ensure that the component is optimized with respect to its application.

http://www.sensonor.com/


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