Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: BAE
BAE
1
Nov 05, 2013 02:42PM

jammin' ,,,,,,,,,, nice find. that BAE article certainly has implications. 45nm chips, ASIC's ready by the end of the year, and qualification(?) by mid 2014.

IMO, Good news.

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Nov 05, 2013 04:18PM
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Nov 05, 2013 05:17PM

Nov 05, 2013 06:06PM
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