Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: 1878 Patent: "Improvement in Hoes"

Ogee, you must be a reporter in your day job, you seem to be able to dig up some amazing stuff, grest job.

As far as that patent goes, would that possible be used as a way of connecting chips, a kind of a slip together connection , or maybe for stacking connections?

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