Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Could our timing be any better? IBM is fiddling with 2.5D and 3D silicon and sounds like they are years behind what PTK is professing to have already acheived with GaaS. Let the bidding wars begin!

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