Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Exactly and like FJ just mentioned, this ability isn't even possible due to this heat/cooling issue with silicon. The big thing here to understand is that while we're getting ridiculous multiples of current maximum silicon speeds (which are at a maximum and squeaking out a couple of percent extra every year at this point at high additional fabrication and materials cost) that when this gets into the industry players hands, they will be able to do what they did with silicon to GaAs (POET) and if we're talking about 20 or a 100x to start, with the additional 4-10x lower power requirements to start, think about what that will mean when the big players get their hands on it.

We're doing this is a University lab (for the most part and now getting the support of the industry players and BAE). Imagine when we start getting it into the state of the art labs. I'm expecting a buyout personally but the fact that they just keep knocking down huge accomplishments month after month now, the risk has just dwindled down.

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