Re: Put a call in to Chris Chu. Waiting for a call back. Eom..dmac88

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Andrea Koch

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Re: Put a call in to Chris Chu. Waiting for a call back. Eom..dmac88

in response to

Re: Put a call in to Chris Chu. Waiting for a call back. Eom..dmac88

PoetryinMotion

posted on May 13, 2014 09:00AM

True, PoetryinMotion. Anyway, if I understood correctly, the brittleness issue is something that has to be taken into account resp. is taken into account during the wafer manufacturing process. Once the chip is sealed in its encasing, brittleness shouldn't be an issue anymore – not even on a deep space probe.