Not to beat a dead horse here but here's an excerpt fron NR dated August 16, 2013

• Drive for Reduction of Feature Size to 100-nm Range (100NM) – The Company will re-prioritize its technical roadmap by introducing specific milestones associated with reducing feature size from the submicronto the 100-nm range in scale, targeting 4Q2013 for that milestone. Consequently, the milestone for full optoelectronic integration on a single die will be re-scheduled to 2Q2014. Even without this full integration milestone, the 100-nm goal anticipates the cadence of commercial III-V foundry capabilities. This roadmap will focus the Company’s ODIS subsidiary on developmental work that will allow for scalable production within existing commercial fabs.

As I read this and compare it to Dr Taylors article, I am hard pressed not believe we have reached MS8. JMHO