Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: New 20F filing from SH

Post# 22660653 ON SH .

I could copy it for you but it was not my find . Hard work by a SH poster .

(ISCFA)

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