Qualcomm Calls for Monolithic 3D IC

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Qualcomm Calls for Monolithic 3D IC

posted on Jun 17, 2014 07:12PM

Jim continued to say: "If the next node doesn't cost less than the last node, we got a problem because I don't think the demand will be there." Well, it is now clear that EUV is not ready and that dimensional scaling below 28nm will require double and triple lithography with its associated additional costs.

http://www.eetimes.com/author.asp?section_id=36&doc_id=1322783

And there, my friends, is why POET is the answer: faster, more efficient and cheaper to build.

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