http://semimd.com/blog/tag/moores-law/
"Qualcomm is looking at “monolithic” 3D-ICs that use normal vias between stacked dies. This can provide a one-process-node advantage along with a 30 percent power savings, 40 percent performance gain, and 5-10 percent cost savings."
Hopefully the good Dr. Is right - "no matter what you end up with Poet"