Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Questions for the AGM

Sorry for the delay (swimming pool with the grandkids). I hope you are right, but ODIS and BAE collaborated for several years, and BAE was the initial foundry to produce the prototype chips. I find it hard to believe they did not jointly develop or modify at least some of the techniques involved in the fabrication process. What that translates to, I don't know and hopefully will find out on Tuesday.

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