Taiwan Semiconductor Manufacturing Co. (TSMC) (NYSE:TSM)—the largest semiconductor chip manufacturer in the world—announced plans to increase its 2015 CAPEX to US $10 billion to accelerate its ramp-up to development and commercial production of 16 nanometer FinFET silicon semiconductor chips. TSMC has identified this push as critical to address the fast-growing smartphone and tablet market. For more details on TSMC’s announcement, please refer to the following link: http://www.eetimes.com/document.asp?doc_id=1324299&.

POET Technologies’ remains steadfast in its plan to deliver the 40 nanometer GaAs (Gallium-Arsenide) chip by year-end 2014, with expected speed capabilities of a 16 nanometer TSMC FinFET silicon chip and the power consumption of a 22 nanometer unit. At 40 nanometers, POET’s GaAs chip is 4 nodes better in logic performance and 3 nodes better in power consumption compared to silicon CMOS—an impressive competitive edge in power, performance, size and cost.

As the PC and Smartphone market is expected to grow to over $220 billion by 2016, POET Technologies has identified the PC and cell phone IC market as an addressable market for its 40nm Gallium-Arsenide semiconductor chip.

For POET Technologies’ latest update, please refer to: http://www.poet-technologies.com/wp-content/uploads/2014/02/POET-Technologies-Corporate-Overview.pdf.

Wayne Gretzky was a believer that you must skate to wear the puck is going to be, not where it currently is.

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