Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: III-V CMOS : Compound Semiconductor 11-12 MARCH 2015, FRANKFURT, GERMANY

The industry sure seems interessted in III-V materials for 2015

http://www.cs-international.net/themes

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