Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Page 23 of Corporate Presentation:

Expansion of POET Lab Facility into a 3rd Party Fab

- Provides POET with operational backup plan (disaster relief)

- Increase the capacity of our R&D process and device IP development

- Replication and transfer of current process at a larger scale

• Multi-wafer and multi-lot

- Automated production manufacturing with concurrent development capability

• ISO Certified Facility

- 3” and 6” wafer sizes capabilities

- Packaging, package and wafer level automated test capabilities

- Prototyping capability at 100-nm critical features with a goal to reduce to 40-nm

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