Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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On February 25, 2015, the Company signed a Collaboration Agreement with BAE Systems ("BAE"), under which BAE will provide non-exclusive third-party foundry services in support of the Company's "Lab-toFab" transition plan. The current phase of the work is expected to be performed between March 2015 and August 2015 at an estimated cost to the Company of $905,000. These services are provided under a statement of work and all intellectual property rights remain with the Company

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