Excellend find, Reiner.
In addition we shoud keep in mind that (according to my poor knowledge about the processing methods) the metallisation - via the sputter tool - is just the last step in the manufacturing process. Simply speeking, this step is connecting the single transistors with copper "wires".
I am sure DNWL can explain this much better...

This means that the ODIS lab could work on this process also without the sputtering or with their old tool, optimising the process by microscopic methods, but it could not finalize and test if the RO really works perfectly and at which speed. But - this last sputtering step could possibly be done by 3rd parties, or just now that the tool is fixed.

So the delays shoud be not dramatic, and possibly the RO is already done and tested by now.