Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: TFSA Transfer in kind ----- IMPORTANT
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Thanks for this post Rainer.

As i can see, for the P channel they could use Germanium or III-V materials.

  1. The industry will adopt strained Germanium (most likely) or III-V materials (as an alternative) for the p-type QWFET channel.

It is always very informative to reed your posts. You are an essential poster for this board.

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