Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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http://www.chipdesignmag.com/blyler/tag/globalfoundries/

If you scroll down the page about a third of the way to the headline Modular FinFET Increases Planar-to-Non-Planar IP Reuse

There is a picture you can click on.

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