Re: TÜV Rheinland expands EHS certification services to III-Vs-Death to silicon

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Re: TÜV Rheinland expands EHS certification services to III-Vs-Death to silicon

in response to

TÜV Rheinland expands EHS certification services to III-Vs

np56

posted on Jul 17, 2015 07:40AM

Hey intel! your time is up... 10, 9, 8, 7...

TÜV says that, because silicon transistor scaling appears to be reaching its limits under current technology, attention is turning to the group III–V compound family of materials including gallium arsenide (GaAs), aluminum arsenide (AlAs), indium arsenide (InAs), and indium gallium arsenide (InGaAs).

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