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Message: Semicon West: The Roadmap is 3D IC
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Maing, I think 3D ICs are more of a packaging technique. They stack chips on chips & side to side. And Cool Cube has managed to monolithically integrate a chip or two within that platform.

https://en.wikipedia.org/wiki/Three-dimensional_integrated_circuit

POET on the other hand is a path for printing(lower CAPEX) ALL components in a fully monolithically integrated platform. Without the need for packaging chips(extra cost).

Semicon West is very much following everything laid out in the presentation of our CEO, Suresh Venkatesan, at Semicon West & LetiDays:

http://www.nist.gov/pml/div683/conference/upload/venkatesan.pdf

http://www.semiconwest.org/SessionsEvents/BusinessPrograms/ctr_037312


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