Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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"In December 2014, the Company also signed a new lease extension with the University of Connecticut (“UCONN”) for a 1-year period which was pre-paid at a significant discount. The new lease includes a possible further two-year extension and provides us the flexibility to transition from Lab to Fab."

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