Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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HI OC,

in deed you will still need some copper to get the data from the silicon chip to the bonded POET chip. But these interconnects will be only some micrometer thin. Electrical resistance is proportional to the distance the current has to travel, and for such very short distances it will be very small. Also inside the chip the data is travelling in copper (still).

Yes, this is not a perfect solution yet. Next step for sure will be the complete monolytical integration of the optics in the logic chip. This can not be done with Si (as it can not lase!), but by a POET chip.

So next year PTK will offer products which will be bonded to silicon chips. It is an intermediate solution and a low hanging fruit. It will solve a lot of problems of data centers, but it will be just the starting point of game changing developements and disruptive products.

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