Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Patent Issued Nov. 5, 2015

I believe you are referring to Jingming Yao when remembering the CV that was posted on LinkedIn. Be sure you are looking at the right Chinese scientist.

:)

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