From Bell Labs about Silicon Photonics

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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From Bell Labs about Silicon Photonics

posted on Jan 04, 2016 10:29AM

New paradigm :

New III-V/Si integration platform combining best of both worlds -

III-V : providing optical gain (Silicon can’t compete for light emission) -

Silicon : Available key building blocks (low loss passive waveguides, wavelength multiplexers/demultiplexers, detectors, modulators)

Key point : molecular bonding of III-V wafers to 200/300mm SOI wafers

Souce, page 9 at : http://www.cominlabs.ueb.eu/documents/58104/539834/talk_CominLabs+-+Breakthrough+in+Optics.pdf/0cd961bd-a16d-4533-b1f9-8be6ec9606bb

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