Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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He didn't say no delay, he said no meaningful change to timeline. Kinda tells you they still think they can find a solution to the epitaxy hurdle, they just have to try different recipies, but it looks like it's taking long each time they run a new recipe and sent it oversea, so all this process is taking longer than expected, but not 1 year longer, the ready to go fine tuned product would not have been ready at beginning of 2017 anyways, most likely around end of year because of all the steps mentioned in the email...
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