Re: TO GLOBE AND MAIL

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Rainer

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Re: TO GLOBE AND MAIL

in response to

TO GLOBE AND MAIL

grizzly

posted on Apr 05, 2017 11:14AM

Grizzly: The Globe and Mail reports in its Wednesday edition …

That's from a 2014 article: http://www.theglobeandmail.com/report-on-business/innovators-at-work/making-the-next-generation-of-semiconductor-chips/article19523814/

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