Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Another was also Filed 3/6/2017 with Publication 8/3/2017 SPLIT-ELECTRODE VERTICAL CAVITY OPTICAL DEVICE

Another was also Filed 3/6/2017 with Publication 8/3/2017 SPLIT-ELECTRODE VERTICAL CAVITY OPTICAL DEVICE

posted on Aug 17, 2017 12:15PM

 

http://patents.justia.com/patent/20170221995

 

I don't recall seeing this one, but may be wrong.

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