Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Re: Bid tender closing date
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Aug 23, 2017 09:33AM
5
Aug 23, 2017 09:41AM

Then there was the unexpected 4T issue that needed a work-around. That proof of concept was also just completed recently.

Great post. Wasn't the PoC for the BICFET workaround done may years ago in the lab under GTs guidance? Hence the switch to it at this late stage. 

5
Aug 23, 2017 02:14PM
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