Posted 26th September on Investorshub by SteveSchiets

Dielectric photonics as a technology for next generation LAN-WDM
Dr Bill Ring, BB Photonics, UK

Photonic integration and reduction in package cost are essential requirements for next generation LAN-WDM components. Today, discrete bulk type optic devices are used to perform the multiplexing and de-multiplexing function within these packages. To reduce cost either integration in the III-V semiconductor device or using silicon photonics platform are the current preferred approaches today.
BB Photonics (A subsidiary of Poet Technologies) has been working extensively in the last couple of years on high speed integrated semiconductor devices and application of dielectric integration with a goal to enable athermal devices and lower cost packaging solutions
In this talk we will discuss the development of dielectric photonics to enable low loss coupling to single mode fiber, integrated wavelength functionality and as a package platform for new lower cost components.

https://photonex.org/conference/silicon-more-details.html#bill

(Michael Lebby of LWLG will also be there.)