Continuing to watch the build up of interesting tenders on the SCL website -Supply of a Tester for CMOS devices, Supply of IC (chip) carriers, Supply of a Sputter Tool for film deposition on wafers, and Supply of 4000 Hydrogen Annealed Silicon wafers. Also a request for Expressions of Interest for IC packaging vendors.  Then the tenders for Epi-ready wafers (Guernsey21 post on GaAs wafers for POE technology devices on May8), MOCVD system precursors (oz4m2 post on May 8) (ISRO Groundwork threads), a Wafer Defect Detection System, and a spectrophotometer for characterizing optical thin film coatings on wafers.  

I also see that the Flicker Measurement system tender from an earlier post in this thread has now been awarded (see ITTR’s post today in the Off Topic forum).

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Supply, Installation and Commissioning of Integrated PXIe based ET Set-up for FA.  Vendor's scope of work shall cover supply, installation & commissioning of PXIe based Electrical Test setup, to be used for electrical testing during Failure Analysis (FA) of CMOS devices, fabricated in 180nm technology node.

Supply of IC Carriers, IC Carrier Lock and Moulding Tool.  The scope of work involves Component Designing, Mould Making and Component Moulding. Component Designing:-Finalization of designs, after some modifications in the attached preliminary designs of components, in consultation with SCL.

Supply, Installation and Commissioning of Two Process Module Cluster Configuration for Multi Target Sputter Tool.  Vendors scope of work shall cover supply, installation and commissioning of two process module cluster configuration for muti target sputter tool with a handler system capable of handling Silicon wafers of size 200 mm and 150mm as per Semi‐Standards. The sputter tool will consist of two process module (PM) for deposition of, 1.Aluminum alloy (1 per cent Si)(PM1) and 2. Ti and TiN (PM2). The scope of work shall include the following, Supply of two process module cluster configuration for muti‐ target sputter tool as per the required specifications. Supply of all support tools. Installation of the equipment and Support Tools (if any), including all utility connections. Commissioning of the equipment and demonstration of its functionality as per the required specifications. On‐site training to concerned SCL personnel on Operations, Maintenance and Trouble shooting of the equipment. The Equipment shall meet all SEMI regulations and must be SEMI compliant.

Tender for 8” (200 mm) Hydrogen Annealed Silicon Product Wafers - Qty. 4000

SCL solicits Expression of Interest (EOI) from the vendors interested to take up prototyping and low volume IC packaging work. The requirements will be both ceramic packaging as well as plastic packaging in various type of packages viz. DIP, QFP, QFN, BGA, SOP, PGA etc. in various pin counts. For ceramic packaging, approximately 200 Nos. to 5000 Nos. of devices will be required whereas for Plastic packaging, 200 Nos. to 50000 Nos. shall be required for each type of products.  Vendors having suitable infrastructure and willing to take up such work are requested to participate in the pre-qualification process. SCL shall be qualifying more than one facility initially for 03 years.

Supply, Installation & Commissioning of Patterned Wafer Inspection Station with Automatic Defect Classification (ADC) capability for 200mm Wafer.

Epi Ready Wafers GaAs and Si. (300 GaAs and 300 Si wafers) This is the POE technology wafers in Guernsey21’s  and oz4m2’s posts from May 8.

Metalorganic Precursors with containers for MOCVD System. (Oz4m2’s post from May 8)

UV -Vis- NIR spectrophotometer Optical Thin Films Characterization. 

Vendor to provide hardware system & accessories such as cables for characterization of Optical thin films coatings (reflectance, transmission, absorbance, and optical constants: refractive index (n) & absorption coefficient (k) values) both on packaged & wafer level.