Oz you will appreciate that the interposer is 1 micron thick. It is hard to wrap your head around but that is 1/50 of the diameter of a human hair.

This is going to be used to connect every manner of silicon chip in the future. It is why Suresh appears so confident that he does not even care what everyone else is doing because over time everyone will need to use their interposer platform to connect the silicon to the active optical devises. The footprint is so small that they will I believe migrate to whatever speed is required.