JOB DESCRIPTION

To develop packaging-optics process and capabilities to meet company’s technology and product roadmap. Aligned to and integrate with in-house manufacturing capabilities and outsource.

• Design and develop advanced packaging-optics technology, as part of DenseLight Hybrid PIC (Photonics Integrated Circuit) packaging development team.
• Perform design and modeling of laser waveguide optics and beam propagation (Zemax - physical optics propagation), and derive physical packaging configuration with design for manufacturing (DFM) parts and process tolerance analysis.
• Perform thermal and mechanical design and analysis (Solidworks) and derive mechanical and thermal model of optical assembly configuration, including specification of DFM parts and process requirement and tolerances.
• Manage and work with DenseLight team members for the development of processes and tools for optical BOM preparation, assembly and test; including packaging process integration, packaged device functional and reliability tests, and the qualification of developed process/products
• To perform required project planning and management, project costing, product/process cost-modeling, required documentation, report generation, presentations and communications.  

Minimum 3 years’ working experience with technical background in optics, optics system, optoelectronics packaging and test processes, and/or optomechanical assembly and test environment

Proven working experience in new product and/or new process development and qualification. 

https://www.jobstreet.com.sg/en/job/optical-packaging-rd-engineer-6336176?fr=21