Thanks, Oz, it's not very often we have gotten to see Poet come to the forefront like this. But I have a feeling we will see a lot more of it in the future
POET Co-Packaging Platform for Electronics and Optics - Device Design and Packaging Award
POET’s co-packaging electronics and optics in a single Multi-Chip Module (MCM) is based on its previously announced Dielectric Waveguide technology.
POET’s Optical Interposer provides the ability to run electrical and optical interconnections side-by-side on the same interposer chip at a micrometre scale.
The company believes its Optical Interposer Platform targeting 100G transceiver applications is readily scalable to 200G and 400G transceiver products with minimal incremental cost.
Importantly, the scalable architecture (in reach and speed) of this innovative platform has the potential to provide POET with a highly differentiated competitive advantage in leading-edge data communication transceiver products.
The platform technology is applicable to both GaAs and InP based optical components. Optical engines for single mode transceiver modules represent the initial high-volume application for POET’s Optical Interposers.
