Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Optical Packaging R&D Engineer

posted on Apr 03, 2018 11:09AM

Optical Packaging R&D Engineer

DenseLight Semiconductors Pte Ltd

Min 3 years (Junior Executive)

Singapore - East - Changi

JOB DESCRIPTION

To develop packaging-optics process and capabilities to meet company’s technology and product roadmap. Aligned to and integrate with in-house manufacturing capabilities and outsource.

Design and develop advanced packaging-optics technology, as part of DenseLight Hybrid PIC (Photonics Integrated Circuit) packaging development team.
Perform design and modeling of laser waveguide optics and beam propagation (Zemax - physical optics propagation), and derive physical packaging configuration with design for manufacturing (DFM) parts and process tolerance analysis.
Perform thermal and mechanical design and analysis (Solidworks) and derive mechanical and thermal model of optical assembly configuration, including specification of DFM parts and process requirement and tolerances.
Manage and work with DenseLight team members for the development of processes and tools for optical BOM preparation, assembly and test; including packaging process integration, packaged device functional and reliability tests, and the qualification of developed process/products
To perform required project planning and management, project costing, product/process cost-modeling, required documentation, report generation, presentations and communications.

Minimum 3 years’ working experience with technical background in optics, optics system, optoelectronics packaging and test processes, and/or optomechanical assembly and test environment

Proven working experience in new product and/or new process development and qualification.