Not just another slide show? At the very least this will be the first time the optical interposer is presented for shareholders, new investors and industry to investigate. Something we have all been asking for since the disclosure of the interposer on Jan 29. And it is being timed for the presentations in NY and Brussels.

Who would have thought a year ago that POET’s Bill Ring would be presenting on a high level industry panel (HIGH VOLUME AND HIGH PERFORMANCE OPPORTUNITIES FOR PICS) with such notable industry representatives:

·        the head of Optical Transmission Research at Bell Labs.

·         Finisar (General Manager of Finisar Germany in Berlin, where he leads a team of about 150 people working on integrated high-speed components for optical fiber communications at 100Gb/s and above),

·        IQE (CEO and member of the High Level Group appointed by the EC to oversee the implementation of Key Enabling Technologies (KETs) throughout Europe.),

·        Intel (Director of Strategic Marketing and Business Development for Intel's Silicon Photonics Product Division)

Interestingly this is just the 3rd PIC International Conference. POET is in the right place.

FIVE KEY INDUSTRY THEMES

The presentations are grouped into five key themes for the 2018 conference which collectively provide complete coverage of the PIC industry.

 Moving the data: PICs for cloud computing and telecoms

 Refining the PIC: achieving the next milestone in performance

 Delivering the goods: advances in PIC manufacturing

 PIC Design, simulation and packaging: a blueprint for future success

 PIC horizons: new and emerging applications for integrated photonics

And of particular interest Facebook’s presentation by Vincent Zeng Manufacturing Quality Engineer responsible for optics at Facebook:

PIC opportunities for datacentres

The growth in network bandwidth at Mega Data-Centers is putting pressure on the photonic technologies to rapidly deliver high-bandwidth interconnects at high volume. In this talk, we will describe Facebook’s scale and some of the trends that are fueling this bandwidth growth. This bandwidth growth will fuel innovation not only in technology, but also in manufacturing processes as traditional technologies struggle to meet the volume challenge. This will change the optics development and commercialization process and open the door for Photonic Integrated Circuits as yield management drives improvements in the wafer-level and advanced photonics packaging with scaled manufacturability and automation.