Let's keep in mind that the interposer platform is a platform, not a product. That is, it has to be tailored to the specific electrical and/or optical chips that are to be connected.

The first specific interposer instance has been tailored and will be produced for POET's receiver/transceiver products – and we should not be too far from production start ("soon"), even though the new equipment has to be installed, calibrated, tested, etc. – This is how I understand the "manufacture" part of the news release.

However, you can use the interposer for connecting any kind of electrical and optical chips, opening a large and wide variety of possible applications. Of course, before manufacturing such a solution, development effort is required. This is how I understand the "develop" part of the news release.

"POET’s “Photonics-in-a-package” solution has the potential to address even larger markets in the future for the integration and co-optimization of ASIC’s and DSP’s with photonics at the interposer and chip level.  We at SilTerra look forward to a long and prosperous relationship between our two companies and our teams.”" (Firdaus Abdullah, CEO SilTerra)