Re: Asia Communications and Photonics Conference, Oct. 26-29th, Hangzhou China

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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fairchijisback

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Re: Asia Communications and Photonics Conference, Oct. 26-29th, Hangzhou China

posted on Sep 26, 2018 09:31AM

ITTR, Looks like they are moving forward with the dielectric integration into sensing products. It is a good indication that they are able to now focus efforts in this area as the Datacom side moves forward.

Here is an example of the kind of system that I expect they intend to improve upon using the POET platform.