Various industry customer requirements

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Various industry customer requirements

posted on Nov 10, 2018 06:08AM

Do-Won Kim

https://www.linkedin.com/in/do-won-kim-83bb01134/

Currently I am working for the development of ROSA and TOSA by hybrid integration of the InP/GaAs PICs and Si optical interposer.

Leading a team for industry R&D program of hybrid integration of 2.5D packaging of opto-electronic devices on Si interposer to meet various industry customer requirements.

Organizing and leading internal/external collaboration and outsourcing for device/interposer design, fabrication, flip-chip bonding, evaluation board assembly, and testing of devices and assemblies.

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