Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
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Under Research and Development Credits - The company has accrued or collected $1,695,383 relating to these research and developement credits in 2017. (Sorry it won't let me cut and paste)
I'm not 100% but I always assumed this credit was from the Singapore EDB.
