Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: OFC presentation - Capacity and Density challenges for Electro-Photonic Integration

Thanks Oz.  I was surprised he made the statement about Moore’s law continuing for a while - this is contrary to predictions made over the last several years.  I guess creativity and money will take you a long way - 5 nm is next - although the costs to achieve that are reducing the number of players.

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