If we look at the INTEL patent it provides some good insight (examples) into what applications they are contemplating that can be applied to POET’s optical interposer platform.

 Silicon photonics has a promising path to ultra-high speed interconnects in electronic systems, for example, more than 50 or 100 gigabits-per-second (Gbps) per line interconnect for supercomputer, high-end data center, and autonomous automobile applications. Such silicon photonics systems may utilize hybrid electrical/optical co-packaging. Silicon photonics may be integrated with silicon electronics by packaging photonics integrated circuits with electronic integrated circuits in multi-chip modules. In this way, advantages of integrating electronic circuits in multi-chip modules can be combined with advantages of optical interconnects. Co-packaging of an optical interconnect engine with electronic integrated circuits (e.g., a central processing unit (CPU) and/or a graphics processing unit (GPU)) in a multi-chip module may provide low interconnect loss for optical interconnects between a photonics integrated circuit in the co-packaged multi-chip module and an edge of a PCB on which the co-packaged multi-chip module is mounted, for example. These multi-chip modules may include three-dimensional (3D) packaging including a CPU/GPU in combination with other electronic and/or photonic devices.