Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: From the new circular

 

I think it is very logical to have contingency planning in place if there is some problem with the timing of the last tranche. 

Bottom line here is where the rubber meets the road and that is twofold...the technology and the right people in place to deliver and navigate to a final outcome of commercial proliferation of the platform. 

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