John

In layman terms, If they connect a test device at the input point on the wafer, would it travel thru every Die on the wafer and finish at the output point, resulting in a positive continuity test and verifying each and every Die on the wafer in one test?

Also verifying how much loss of signal if any, and then proceeding to seperate all die on the wafer, to be installed in whatever package it would be used in, and tested to meet Prototype standards.

Thx Ron