Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications
Message: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
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Re: Patent: METHOD OF FORMING AN HERMETIC SEAL ON ELECTRONIC AND OPTOELECTRONIC PACKAGES
John, it’s fortunate for you and your family that you didn’t try to make a living writing instructions on assembling kids’ toys - I’m afraid you would not have made it! LOL.