Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Intel co-packaged solution

BCD

This sure has a likeness to Poet's OI. Especially when they talk about it in this paragraph. Less power needed, less heat created and higher output, in a smaller configuration. Hopeful possibility.

The team at Intel has developed a photonic engine with the equivalent processing power of sixteen 100-GB transceivers, or 4 of the latest 12.8 TB generation. The standout feature of the new chip is its co-packaging, a method of close physical integration of the necessary electrical components with faster, lossless optical ones.

The close integration of the optical components allows Intel’s engine to “break the wall,” of the maximum density of pluggable port transceivers on a switch ASIC, according to Blum. More ports on a switch—the specialized processor that routes data traffic—mean higher processing power, but only so many connectors can fit together before overheating becomes a threat.

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