Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

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Message: Required yield, and capacity...

Maybe a misunderstanding here of what the OI is.

The optical interposer starts our life in a wafer foundry that specializes in Indium Phospide based epitaxial stacks (or layers). All of the components that make up the POET interposer are all passive entities built into the stack. Once the stack (or special sauce as FJ calls it) is known, it is repeated over the entire surface of the wafer (up to 500 times approx. for the POET requirement). Each one of these tiny constructs as called a die and after the wafer is formed, these die (now the individual OI) are tested at wafer level and then they must be cut from the wafer, by a number of different methods. That tiny little die dude is a platform, containing all the elements necessary (waveguides, mux, demux, filters, etc) to go to work as part of somebody elses product.

I think what may be misunderstood, is that POET is now perfecting the process of modifying certain elements within the die to make it more suitable for specific uses and keep in mind that the OI is speed egnostic. 100, 400 800g, it doesn't care, changes to alignment and width within the die and the compatable external components of the customers product take care of that.

If this OI is what it appears to be, and it is always "if" until it actually hits the ground running, this is a truly remarkable achievement, carried out on so little money, by people who believe that the idea of "disruptive" is still possible at the cutting edge of science and technology

IMO, of course

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