Re: Exposed

Aiming to become the global leader in chip-scale photonic solutions by deploying Optical Interposer technology to enable the seamless integration of electronics and photonics for a broad range of vertical market applications

Reply New Message

Prev Message Back To Forum Threaded View Next Message

rogue

Rank: Treasurer [?]

Points: 311 [?]

Votes: 136 Score: 2.8 [?]

Your Vote:

Please Log In to Vote

Did you know? You can earn activity points by filling your profile with information about yourself (what city you live in, your favorite team, blogs etc.)

Re: Exposed

in response to

Re: Exposed

McWitty

posted on Apr 08, 2020 01:23PM

McWitty,

This is about using large electrical interposers to stitch together chips to produce a system (SIP = system in package) of chips larger than the largest chip a fab can produce. It mentions super computing and AI where you need lots of processing and memory close together. Doesn't seem relevant right now as this is about an electronic chip interfacing to another electronic chip through an electric interposer. (future on-chip optics could change this). They need more than one chip can provide so they either spread out on a large 2D interposer or stack chips with 3D interposer.