Sollozzo posted this in off topic. I think it should be over here as well, so with his permission I will repost it! Well worth a listen:

"Skip to 3:46 of video. Very interesting. They are sampling now but expect production in the second half of 2020"

https://www.lightwaveonline.com/optical-tech/transmission/video/14174466/400g-module-update-with-acacia-communications 

« Design of a Optoelectronics Component that takes all the high speed chips, the DSP, PIC, Driver and TIA. It Co-Packages them using 3D integration technology this gives us benefits in terms of performance ,cost and power and it allows that device as manufactured on a high volume CMOS manufacturing line using standard processes and so by doing this we think we get benefits in terms of automation, reliability and scale. We really think this packaging technology is letting is take the next step forward in leveraging the benefits of Silicon Photonics«